Interposer and semiconductor package including the same

ABSTRACT

A semiconductor package includes an interposer having multiple connection structures, each including redistribution layers electrically connected to each other, and a passivation layer covering at least a portion of each of the connection structures and filling a space between the connection structures. A first semiconductor chip is disposed on the interposer and has first connection pads, and a second semiconductor chip is disposed adjacent to the first semiconductor chip on the interposer and has second connection pads. The connection structures are independently arranged to each at least partially overlap with one or both of the first and second semiconductor chips, in a stacking direction of the first and second semiconductor chips on the interposer. The redistribution layers of each of the connection structures are electrically connected to at least one of the first and second connection pads via under bump metals.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims benefit of priority to Korean Patent ApplicationNo. 10-2018-0156194 filed on Dec. 6, 2018 in the Korean IntellectualProperty Office, the disclosure of which is incorporated herein byreference in its entirety.

BACKGROUND

The present disclosure relates to an interposer and semiconductorpackage including the same.

The interposer market is growing due to high quality requirements forthe set of product and the adoption of High Bandwidth Memory (HBM).Recently, silicon has mainly been used as a material of the interposer.For example, in the case of a semiconductor package using an interposer,a die may be surface-mounted on a silicon-based interposer, and theinterposer may then be molded with a molding material to prepare thesemiconductor package.

In the meantime, as quality requirements of the set have increasedrecently, the size of the interposer is becoming larger due to anincrease in the number of HBMs, comparing to the conventional product.Therefore, there is emerging a high risk that process difficulty willincrease and yield therefrom will decrease.

SUMMARY

An aspect of the present disclosure is to provide a semiconductorpackage capable of lowering process difficulty, increasing efficiencyand yield in process, and solving a warpage or a misalignment problem,while still providing an interposer having a relatively large area.

According to an aspect of the present disclosure, a plurality ofconnection structures is prepared by separating redistribution regionshaving different process difficulties, the plurality of connectionstructures are disposed in parallel in a single passivation layer toform an interposer, and a plurality of semiconductor chips are disposedon and electrically connected to the interposer.

According to an aspect of the present disclosure, a semiconductorpackage includes an interposer including a plurality of connectionstructures disposed to be spaced apart from each other, and eachincluding a respective insulation layer and a respective plurality ofredistribution layers disposed in or on the respective insulation layerand electrically connected to each other, the redistribution layers ofdifferent connection structures of the plurality of connectionstructures being parallel to each other. The interposer further includesa passivation layer covering at least a portion of each of the pluralityof connection structures and filling at least a portion of a spacebetween the plurality of connection structures. A first semiconductorchip is disposed on the interposer and has a plurality of firstconnection pads, and a second semiconductor chip is disposed adjacent tothe first semiconductor chip on the interposer and has a plurality ofsecond connection pads. The plurality of connection structures areindependently disposed to each at least partially overlap with at leastone of the first and second semiconductor chips, in a stacking directionof the first and second semiconductor chips on the interposer. Theplurality of redistribution layers of each of the plurality ofconnection structures are electrically connected to at least one of thepluralities of first and second connection pads, and the insulationlayers and the passivation layer include different materials.

According to another aspect of the present disclosure, a semiconductorpackage includes an interposer including a plurality of connectionstructures disposed to be spaced apart from each other, and eachincluding a plurality of respective redistribution layers electricallyconnected to each other, the redistribution layers of differentconnection structures of the plurality of connection structures beingparallel to each other. The interposer further includes a passivationlayer covering at least a portion of each of the plurality of connectionstructures and filling at least a portion between the plurality ofconnection structures, and a plurality of under bump metals eachincluding a metal pad disposed on the passivation layer and a metal viapassing through the passivation layer and electrically connecting themetal pad and a redistribution layer of the plurality of redistributionlayers. A first semiconductor chip is disposed on the interposer and hasa plurality of first connection pads, and a second semiconductor chip isdisposed adjacent to the first semiconductor chip on the interposer andhas a plurality of second connection pads. The plurality of connectionstructures are disposed to each at least partially overlap with at leastone of the first and second semiconductor chips, in a stacking directionof the first semiconductor chip on the interposer. The plurality ofredistribution layers of each of the plurality of connection structuresare electrically connected to at least one of the plurality of first andsecond connection pads via the plurality of under bump metals.

According to a further aspect of the present disclosure, an interposerfor connecting and redistributing a plurality of connection pads of oneor more semiconductor chips mounted on an upper surface thereof toconnection structures exposed through a lower surface thereof includes aplurality of connection structures disposed to be spaced apart from eachother, each including a respective insulation layer and a respectiveplurality of redistribution layers disposed in or on the respectiveinsulation layer and electrically connected to each other, theredistribution layers of different connection structures of theplurality of connection structures being parallel to each other in theinterposer. The interposer further includes a passivation layer havingthe plurality of connection structures embedded therein, the passivationlayer extending over upper surfaces of each of the plurality ofconnection structures, and the passivation layer having lower surfacesof each of the plurality of connection structures exposed through alower surface thereof.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a schematic block diagram illustrating an example of anelectronic device system.

FIG. 2 is a schematic perspective view illustrating an example of anelectronic device.

FIG. 3 is a schematic cross-sectional view illustrating a 3D ball gridarray (BGA) package mounted on a main board of an electronic device.

FIG. 4 is a schematic cross-sectional view illustrating a 2.5 D siliconinterposer package mounted on a main board.

FIG. 5 is a schematic cross-sectional view illustrating a 2.5 D organicinterposer package mounted on a main board.

FIG. 6 is a schematic cross-sectional view illustrating an example of asemiconductor package in accordance with the principles of thedisclosure.

FIG. 7 is a schematic enlarged cross-sectional view illustrating regionA of the semiconductor package of FIG. 6.

FIG. 8 is a cross-sectional view of the semiconductor package takenalong line I-I′ of FIG. 6.

FIG. 9 is a cross-sectional view of another semiconductor package, takenalong line I-I′ of FIG. 6.

FIG. 10 is a cross-sectional view of another semiconductor package,taken along line I-I′ of FIG. 6.

FIG. 11 is a cross-sectional view of another semiconductor package,taken along line I-I′ of FIG. 6.

FIG. 12 is a cross-sectional view of another semiconductor package,taken along line I-I′ of FIG. 6.

FIGS. 13 to 15 are schematic figures illustrating process steps of amethod of manufacturing the semiconductor package of FIG. 6.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described asfollows with reference to the attached drawings.

Electronic Device

FIG. 1 is a schematic block diagram illustrating an example of anelectronic device system.

Referring to FIG. 1, an electronic device 1000 may accommodate amainboard 1010 therein. The mainboard 1010 may include chip relatedcomponents 1020, network related components 1030, other components 1040,and the like, physically or electrically connected thereto. Thesecomponents may be connected to others to be described below by varioussignal lines 1090.

The chip related components 1020 may include a memory chip such as avolatile memory (for example, a dynamic random access memory (DRAM)), anon-volatile memory (for example, a read only memory (ROM)), a flashmemory, or the like; an application processor chip such as a centralprocessor (for example, a central processing unit (CPU)), a graphicsprocessor (for example, a graphics processing unit (GPU)), a digitalsignal processor, a cryptographic processor, a microprocessor, amicrocontroller, or the like; and a logic chip such as ananalog-to-digital converter (ADC), an application-specific integratedcircuit (ASIC), or the like. However, the chip related components 1020are not limited thereto, but may also include other types of chiprelated components. In addition, the chip related components 1020 may becombined with each other.

The network related components 1030 may include components operatingaccording to protocols such as wireless fidelity (Wi-Fi) (Institute ofElectrical And Electronics Engineers (IEEE) 802.11 family, or the like),worldwide interoperability for microwave access (WiMAX) (IEEE 802.16family, or the like), IEEE 802.20, long term evolution (LTE), evolutiondata only (Ev-DO), high speed packet access+(HSPA+), high speed downlinkpacket access+(HSDPA+), high speed uplink packet access+(HSUPA+),enhanced data GSM environment (EDGE), global system for mobilecommunications (GSM), global positioning system (GPS), general packetradio service (GPRS), code division multiple access (CDMA), timedivision multiple access (TDMA), digital enhanced cordlesstelecommunications (DECT), Bluetooth, 3G, 4G, and 5G protocols, and anyother wireless and wired protocols, designated after the abovementionedprotocols. However, the network related components 1030 are not limitedthereto, but may also include components operating according to avariety of other wireless or wired standards or protocols. In addition,the network related components 1030 may be combined with each other,together with the chip related components 1020 described above.

Other components 1040 may include a high frequency inductor, a ferriteinductor, a power inductor, ferrite beads, a low temperature co-firedceramic (LTCC), an electromagnetic interference (EMI) filter, amultilayer ceramic capacitor (MLCC), or the like. However, othercomponents 1040 are not limited thereto, but may also include passivecomponents used for various other purposes, or the like. In addition,other components 1040 may be combined with each other, together with thechip related components 1020 or the network related components 1030described above.

Depending on a type of the electronic device 1000, the electronic device1000 may include other components that may or may not be physically orelectrically connected to the mainboard 1010. These other components mayinclude, for example, a camera 1050, an antenna 1060, a display 1070, abattery 1080, an audio codec (not illustrated), a video codec (notillustrated), a power amplifier (not illustrated), a compass (notillustrated), an accelerometer (not illustrated), a gyroscope (notillustrated), a speaker (not illustrated), a mass storage unit (forexample, a hard disk drive) (not illustrated), a compact disk (CD) drive(not illustrated), a digital versatile disk (DVD) drive (notillustrated), or the like. However, these other components are notlimited thereto, but may also include other components used for variouspurposes depending on a type of electronic device 1000, or the like.

The electronic device 1000 may be a smartphone, a personal digitalassistant (PDA), a digital video camera, a digital still camera, anetwork system, a computer, a monitor, a tablet PC, a laptop PC, anetbook PC, a television, a video game machine, a smartwatch, anautomotive component, or the like. However, the electronic device 1000is not limited thereto, but may be any other electronic deviceprocessing data.

FIG. 2 is a schematic perspective view illustrating an example of anelectronic device.

Referring to the drawings, a semiconductor package including an organicinterposer may be used for various purposes in the various electronicdevices as described above. For example, a motherboard 1110 may beaccommodated in a body 1101 of a smartphone 1100, and various electroniccomponents 1120 may be physically and/or electrically connected to themotherboard 1110. In addition, other components that may or may not bephysically or electrically connected to the motherboard 1110, such as acamera 1130, may be accommodated in the body 1101. Some of theelectronic components 1120 may be the chip related components, forexample, a semiconductor package 1121, but are not limited thereto. Theelectronic device is not necessarily limited to the smartphone 1100, butmay be other electronic devices as described above.

Semiconductor Package

Generally, numerous fine electrical circuits are integrated in asemiconductor chip. However, the semiconductor chip may not serve as afinished semiconductor product in itself, and may be damaged due toexternal physical or chemical impacts. Therefore, the semiconductor chipitself may not be used, but may be packaged and used in an electronicdevice, or the like, in a packaged state.

Semiconductor packaging is commonly used to compensate for a differencein a circuit width between the semiconductor chip and a mainboard of theelectronic device in terms of electrical connections. In detail, a sizeof connection pads of the semiconductor chip and an interval between theconnection pads of the semiconductor chip are very fine, but a size ofcomponent mounting pads of the mainboard used in the electronic deviceand an interval between the component mounting pads of the mainboard aresignificantly larger than those of the semiconductor chip. Therefore, itmay be difficult to directly mount the semiconductor chip on themainboard, and packaging technology for buffering a difference in acircuit width between the semiconductor chip and the mainboard isadvantageously employed.

Hereinafter, the use of an interposer in a semiconductor packagemanufactured by such a packaging technique will be described in moredetail with reference to the drawings.

FIG. 3 is a schematic cross-sectional view illustrating a case in whicha 3D ball grid array (BGA) package is mounted on a main board of anelectronic device.

Since application specific integrated circuits (ASICs) such as graphicsprocessing units (GPUs) in semiconductor chips may be very expensive, itmay be very important to carry out packaging at a relatively high yield.For this purpose, a ball grid array (BGA) substrate 2210 or the likecapable of redistributing thousands to millions of connection pads maybe prepared before a semiconductor chip is mounted. Next, asemiconductor chip such as an expensive semiconductor chip, for example,a GPU 2220, or the like, may be subsequently mounted and packaged on aBGA substrate 2210 by a surface mounting technology (SMT) or the like,and may be then finally mounted on a main board 2110.

Meanwhile, the GPU 2220 may need to minimize a signal path to a memorysuch as a high bandwidth memory (HBM). To this end, a semiconductor chipsuch as HBM 2240 may be mounted on an interposer 2230 and packaged, andmay be then used by stacking the same on a package on which the GPU 2220is mounted, in the form of a package on package (POP). In this case,there may be problems that a thickness of the device becomes too thick,and a signal path is also limited to be minimized.

FIG. 4 is a schematic cross-sectional view illustrating a case in whicha 2.5D silicon interposer package is mounted on a main board.

As one of proposals for solving the above-described problems, it may beconsidered to manufacture a semiconductor package 2310 including asilicon interposer using a 2.5D interposer technology that a firstsemiconductor chip such as a GPU 2220 and a second semiconductor chipsuch as an HBM 2240 may be surface-mounted and packaged on a siliconinterposer 2250 in parallel. In this case, the GPU 2220 and the HBM 2240having thousands to millions of connection pads may be redistributedthrough the interposer 2250, and may be electrically connected to eachother via a minimum path. The semiconductor package 2310 including sucha silicon interposer is again mounted and redistributed on a BGAsubstrate 2210 or the like, to finally mount the semiconductor packageon the main board 2110. In the case of the silicon interposer 2250,since formation of a through silicon via (TSV) may be very difficult,and manufacturing costs thereof may be also considerable, it may bedisadvantageous for increasing an area and lowering manufacturing costsof the semiconductor package.

FIG. 5 is a schematic cross-sectional view illustrating a case in whicha 2.5D organic interposer package is mounted on a main board.

As one of proposals for solving the above-described problems, it may beconsidered to use an organic interposer 2260 instead of the siliconinterposer 2250. For example, it may be considered to manufacture asemiconductor package 2320 including the organic interposer using a 2.5Dinterposer technique in which a first semiconductor chip, such as a GPU2220, and a second semiconductor chip, such as an HBM 2240, may besurface-mounted and packaged on the organic interposer 2260 in parallel.In this case, the GPU 2220 and the HBM 2240 having thousands to millionsof connection pads may be redistributed through the interposer 2260, andmay be electrically connected to each other via a minimum path. Thesemiconductor package 2320 including such an organic interposer is againmounted and redistributed on a BGA substrate 2210 or the like, tofinally mount the semiconductor package on the main board 2110. Further,it may be advantageous for increasing an area and lowering manufacturingcosts of the semiconductor package. When a molding process is performedon the semiconductor package 2320 including the organic interposer, dueto mismatch in coefficient of thermal expansion (CTE) between moldingmaterials of the interposer 2260 and the chips 2220 and 2240, and thelike, there may be problems such as occurrence of warpage, poor fillingof an underfill resin, occurrence of cracking between a die and amolding material, and the like. Further, in the case of the organicinterposer, it may be disadvantageous for realizing a fine patternthereon.

As one of proposals for solving the above-described problems, althoughit is not illustrated in detail in the drawings, it may be consideredthat a silicon-based interconnection bridge having a fine pattern isseparately formed and inserted into a cavity of a BGA substrate. In thiscase, it may be difficult to form the cavity and correspondingmicrocircuits in the BGA substrate, which may cause a problem regardingprocess and yield reduction. Therefore, there may be a demand for a newtype of semiconductor package capable of solving all these problems.

FIG. 6 is a schematic cross-sectional view illustrating an example of asemiconductor package.

FIG. 7 is a schematic enlarged cross-sectional view illustrating regionA of the semiconductor package of FIG. 6.

FIG. 8 is a schematic cross-sectional view illustrating thesemiconductor package taken along line I-I′ of FIG. 6.

Referring to the drawings, a semiconductor package 100 according to anexample may include an interposer 110, a first semiconductor chip 121disposed on the interposer 110 and having a plurality of firstconnection pads 121P, and a second semiconductor chip 122 disposedaround the first semiconductor chip 121 on the interposer 110 and havinga plurality of second connection pads 122P. In this case, the interposer110 may include a plurality of connection structures 111, 112, and 113,disposed to be spaced apart from and parallel to each other, andincluding respective insulation layers 111 a, 112 a, and 113 a and aplurality of respective redistribution layers 111 b, 112 b, and 113 bdisposed in or on the insulation layers 111 a, 112 a, and 113 a andelectrically connected to each other, and the redistribution layers 111b, 112 b, and 113 b may be parallel to each other, and a passivationlayer 115 covering at least a portion of each of the plurality ofconnection structures 111, 112, and 113 and filling at least a portionbetween the plurality of connection structures 111, 112, and 113. Theplurality of connection structures 111, 112, and 113 may beindependently arranged to each at least partially overlap at least oneof the first and second semiconductor chips 121 and 122, in plan view.The plurality of redistribution layers 111 b, 112 b, and 113 b of eachof the plurality of connection structures 111, 112, and 113 may beelectrically connected to at least one of the plurality of first andsecond connection pads 121P and 122P. Overlapping in plan view refers tothere being a region overlapping each other between components arrangedon different levels, when the semiconductor package 100 is viewed froman upper or lower position thereof, for example, when viewed accordingto the view illustrated in FIG. 8, and the like.

As described above, as the high quality requirements of the set increaserecently, the size of the interposer is becoming larger as a result ofan increase in the number of HBMs, in comparison to the conventionalproduct. Therefore, there is emerging a high risk that processdifficulty increases and yield therefrom decreases. For example, whenthe number of HBMs employed increases from four (4) to eight (8), anarea of the package will be approximately 2.5 times larger than theprevious one, and thus an area used for a fine redistribution layer(Fine RDL) will also be two (2) times or more. As the area of the fineredistribution layer increases, the process difficulty of manufacturingthe layer may increase. As a result, defects related to foreign mattersand systematization may also increase proportionally. This may result inlowering competitiveness of the product due to the process cost.

A semiconductor package 100 according to an example may have aconfiguration by preparing separately regions, different in the processdifficulty, for example, a region of the first redistribution layer 111b of the first connection structure 111 for redistributing the firstsemiconductor chip 121, a region of the second redistribution layer 112b of the second connection structure 112 for redistributing the secondsemiconductor chip 122, and a region of the third redistribution layer113 b of the third connection structure 113 for electrically connectingthe first and second semiconductor chips 121 and 122, respectively, toconform their process abilities. In turn, only good components from theprepared first to third connection structures 111, 112, and 113 may beselected through electrical inspection to separate them from each otherby a singulation process in a unit. Next, the selected connectionstructures may be arranged to correspond to the positions of the firstand second semiconductor chips 121 and 122, and the interposer 110 maythereby be prepared in a manner in which a passivation layer 115 coversthe first to third connection structures 111, 112, and 113. Finally, thefirst and second semiconductor chips 121 and 122 may be surface-mountedon the interposer 110.

Since the first to third connection structures 111, 112, and 113 may beprepared by separating a region having a high degree of processdifficulty and a region having a low degree of process difficulty,process difficulty may be relatively reduced, yield improvement may befacilitated, and efficiency in a process and space utilization in apanel may be maximized. In addition, since the separate first to thirdconnection structures 111, 112, and 113 may be integrated together inthe carrier, handling issues due to warpage may also be improved incomparison to a structure in which multiple redistribution layers arecontinuously formed over a relatively large area, such as a conventionalsilicon interposer or an organic interposer.

In a semiconductor package 100 according to an example, the insulationlayers 111 a, 112 a, and 113 a of the plurality of connection structures111, 112, and 113 may include a material different from that of thepassivation layer 115. For example, each of the insulation layers 111 a,112 a, and 113 a and the passivation layer 115 may be a photosensitiveinsulation layer including a photo-imageable dielectric (PID). Each ofthe insulation layers 111 a, 112 a, and 113 a may be a positive-typephotosensitive insulation layer formed in a liquid type. The passivationlayer 115 may be a negative-type photosensitive insulation layer formedin a film type. When the insulation layers 111 a, 112 a, and 113 a ofthe plurality of connection structures 111, 112, and 113 are thepositive-type photosensitive insulation layer formed in the liquid type,the redistribution layers 111 b, 112 b, and 113 b, and connection vias111 c, 112 c, and 113 c may be finely designed in a fine shape. At thesame time, when the passivation layer 115 is the negative-typephotosensitive insulation layer formed in the film type, an effect forcontrolling warpage may be enhanced. In addition, by effectively fillingspace between the plurality of connection structures 111, 112, and 113,the void problem may be prevented and the thickness deviation may bealso reduced.

A semiconductor package 100 according to an example may further includea plurality of under bump metals 114 respectively including a metal pad114 a disposed on the passivation layer 115 and a metal via 114 bpassing through the passivation layer 115 and electrically connectingthe metal pad 114 a and the plurality of redistribution layers 111 b,112 b, and 113 b. The plurality of under bump metals 114 may compensatefor misalignment between the plurality of redistribution layers 111 b,112 b, and 113 b, and the plurality of first and second connection pads121P and 122P, which may occur during embodiment of the plurality ofconnection structures 111, 112, and 113, and may electrically connectthem. Accordingly, although the plurality of connection structures 111,112, and 113 are separately manufactured, and then embedded and disposedin the interposer 110 as described above, the misalignment may beeffectively solved.

The plurality of under bump metals 114 may be electrically connected tothe plurality of first and second connection pads 121P and 122P througha plurality of connection members 140. The plurality of connectionmembers 140 may include a low melting metal selected from the groupconsisting of tin (Sn), and alloys containing tin (Sn), respectively,and, may be, for example a solder bump. The first and secondsemiconductor chips 121 and 122 may be surface-mounted on the interposer110 using the plurality of under bump metals 114 and the plurality ofconnection members 140. In this case, the first and second semiconductorchips 121 and 122 may be fixed to the underfill resin 150 disposed onthe interposer 110, respectively. The underfill resin 150 may cover atleast a portion of each of the plurality of under bump metals 114 andthe plurality of connection members 140 between the first and secondsemiconductor chips 121 and 122 and the interposer 110, and may alsocover at least a portion of each of a plurality of first and secondmetal bumps 121B and 122B which may be respectively disposed on thefirst and second connection pads 121P and 122P described later.

A semiconductor package 100 according to an example may further includean encapsulant 130 disposed on the interposer 110 and covering at leasta portion of each of the first and second semiconductor chips 121 and122 and the underfill resin 150. The encapsulant 130 may protect andfurther fix the first and second semiconductor chips 121 and 122 at thesame time. A back surface of each of the first and second semiconductorchips 121 and 122 and a back surface of the encapsulant 130 mayoptionally be coplanar through a grinding process. When the backsurfaces of the semiconductor chips 121 and 122 are exposed, the heatradiation effect may be improved. Here, it can be understood that thecoplanar refers not only to a form of complete coplanariry, but also toconsider a rough coplanarity, for example, considering a minutethickness deviation occurring in the process, and the like. Hereinafter,term “coplanar” is applied in a similar manner as described above.

In a semiconductor package 100 according to an example, a plurality ofconnection structures 111, 112, and 113 may have substantially the samethickness as each other. The plurality of connection structures 111,112, and 113 may include the same number of redistribution layers 111 b,112 b, and 113 b. In this case, when the plurality of connectionstructures 111, 112, and 113 are covered with a passivation layer 115, asubstantially flat surface may be provided. Therefore, first and secondsemiconductor chips 121 and 122 may be easily mounted and arranged.Herein, it can be understood that the term “substantially” refers notonly to the complete/exact same, but also to approximately the same, forexample, considering a minute thickness deviation occurring in theprocess. Hereinafter, term “substantially” is applied in a similarmanner as described above.

In a semiconductor package 100 according to an example, a surfaceopposite to a surface of the insulation layers 111 a, 112 a, and 113 aof each of the plurality of connection structures 111, 112, and 113,facing the first and second semiconductor chips 121 and 122, may becoplanar with a surface opposite to a surface of the passivation layer115, facing the first and second semiconductor chips 121 and 122, forexample, lower surfaces thereof in the drawing may be coplanar. In thiscase, a plurality of connection structures 111, 112, and 113 havingsubstantially the same thickness may be disposed on the same level aseach other on the carrier, such that a substantially flat surface may beprovided, when the plurality of connection structures 111, 112, and 113may be covered with the passivation layer 115. In addition, after thecarrier is removed, a first electrical connection metal 160 forconnecting to a printed circuit board 200 and the like may bemanufactured on the same level. Therefore, the semiconductor package 100may be easily mounted on the printed circuit board 200 and the like.

Hereinafter, each configuration included in a semiconductor package 100according to one example will be described in detail with reference tothe drawings.

An interposer 110 may redistribute first and second connection pads 121Pand 122P of first and second semiconductor chips 121 and 122, and mayelectrically connect the first and second connection pads 121P and 122Pto each other. Several tens to millions of the first and secondconnection pads 121P and 122P having various functions may beredistributed through the interposer 110, and may be physically and/orelectrically connected to other components, in accordance with functionsthereof. The interposer 110 may include a plurality of connectionstructures 111, 112, and 113, and a passivation layer 115 covering atleast a portion of each of the plurality of connection structures 111,112, and 113 and filling at least a portion between the plurality ofconnection structures 111, 112, and 113, and, preferably, may furtherinclude a plurality of under bump metals 114 respectively including ametal pad 114 a disposed on the passivation layer 115 and a metal via114 b passing through the passivation layer 115 and electricallyconnecting the metal pad 114 a and the plurality of redistributionlayers 111 b, 112 b, and 113 b.

The plurality of connection structures 111, 112, and 113 may includefirst to third connection structures 111, 112, and 113. The firstconnection structure 111 may be disposed such that at least a portionthereof overlaps the first semiconductor chip 121, in plan view, thesecond connection structure 112 may be disposed such that at least aportion thereof overlaps the second semiconductor chip 122, in planview, and the third connection structure 113 may be disposed such thatat least a portion thereof respectively overlaps the first and secondsemiconductor chips 121 and 122, in plan view. Optionally, the number ofeach of the first to third connection structures 111, 112, and 113 maybe greater than that illustrated in the drawing. The plurality ofconnection structures 111, 112, and 113 may have substantially the samethickness as each other. For example, the plurality of connectionstructures 111, 112, and 113 may include the same number ofredistribution layers 111 b, 112 b, and 113 b as each other. In thiscase, when the plurality of connection structures 111, 112, and 113 arecovered with the passivation layer 115, a substantially flat surface maybe provided. Therefore, the first and second semiconductor chips 121 and122 may be easily mounted and arranged.

The first connection structure 111 may serve to redistribute the firstconnection pad 121P of the first semiconductor chip 121. The firstconnection structure 111 may include a first insulation layer 111 a, aplurality of first redistribution layers 111 b disposed on or in thefirst insulation layer 111 a, and a plurality of first connection vias111 c disposed in the first insulation layer 111 a and electricallyconnecting the plurality of first redistribution layers 111 b to eachother. The number of layers of the first insulation layer 111 a and ofthe first redistribution layer 111 b, and the number of vias of thefirst connection via 111 c, are not particularly limited, and may varydepending on the design.

As the material of the first insulation layer 111 a, an insulatingmaterial may be used. As the insulating material, a photosensitiveinsulating material such as PID may be used. For example, the firstinsulation layer 111 a may be a photosensitive insulation layer. Whenthe first insulation layer 111 a has photosensitive property, the firstinsulation layer 111 a may be formed to be relatively thinner, and thefirst insulation layer 111 a may more easily achieve the fine pitch ofthe first redistribution layer 111 b and the first connection via 111 c.The first insulation layer 111 a may be a positive-type photosensitiveinsulation layer formed in a liquid type as described above. The firstconnection structure 111 may be an organic block including an organicmaterial. The first insulation layer 111 a may have a multilayerstructure. The first insulation layer 111 a may be seen as a multilayerstructure in which boundaries of the respective layers may be distinct,and may be seen as one layer in which boundaries of the respectivelayers may be unclear. A lowermost surface of the first insulation layer111 a may be coplanar with a lowermost surface of the passivation layer115.

The first redistribution layer(s) 111 b may function to redistribute thefirst connection pad 121P, and, as a material for formation thereof, ametal material such as copper (Cu), aluminum (Al), silver (Ag), tin(Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloysthereof may be used. The first redistribution layer(s) 111 b may performvarious functions, depending on a desired design. For example, a groundpattern, a power pattern, a signal pattern, and the like may beincluded. The ground pattern and the power pattern may be the samepattern. The signal pattern may include various signal patterns exceptfor a ground pattern, a power pattern, and the like, for example, a datasignal pattern. A variety of connection via pads, electrical connectionmetal pads, and the like may be also included. The lowermost surface ofthe first redistribution layer(s) 111 b may be exposed from thelowermost surface of the first insulation layer 111 a, and may be usedas a pad for connection with the first electrical connection metal 160.A surface treatment layer (not illustrated) may be formed on the surfaceof the pad pattern for the first electrical connection metal 160 on thelowermost surface of the first redistribution layer 111 b, and thesurface treatment layer may be plated with nickel (Ni)/gold (Au) or thelike.

The first connection via(s) 111 c may electrically connect the firstredistribution layers 111 b disposed on different layers, therebyforming an electrical path. As the material for forming the firstconnection via(s) 111 c, a metal material, such as copper (Cu), aluminum(Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium(Ti), or alloys thereof may be used. Each first connection via 111 c maybe a filled type via filled with a metal material, or may be a conformaltype via in which a metal material is formed along a wall surface of avia hole. Further, it may have a tapered shape in which a width of anupper surface thereof is wider than a width of a lower surface thereof.The first connection via(s) 111 c may have a signal via, a ground via, apower via, etc., and the ground via and power via may be the same vias.

The second connection structure 112 may function to redistribute thesecond connection pad 122P of the second semiconductor chip 122. Thesecond connection structure 112 may be disposed in a one-to-manyrelationship with the second semiconductor chip 122 for convenience ofalignment. For example, one second connection structure 112 may bedisposed corresponding to the two second semiconductor chips 122. Thesecond connection structure 112 may include a second insulation layer112 a, a plurality of second redistribution layers 112 b disposed on orin the second insulation layer 112 a, and a plurality of secondconnection vias 112 c disposed in the second insulation layer 112 a andelectrically connecting the plurality of second redistribution layers112 b to each other. The second insulation layer 112 a may have amultilayer structure. The number of layers of the second insulationlayer 112 a and of the second redistribution layer 112 b, and the numberof vias of the second connection via 112 c, are not particularlylimited, and may vary depending on the design.

As the material of the second insulation layer 112 a, an insulatingmaterial may be used. As the insulating material, a photosensitiveinsulating material such as PID may be used. For example, the secondinsulation layer 112 a may be a photosensitive insulation layer. Whenthe second insulation layer 112 a has photosensitive property, thesecond insulation layer 112 a may be formed to be relatively thinner,and the second insulation layer 112 a more easily achieve the fine pitchof the second redistribution layer 112 b and the second connection via112 c. The second insulation layer 112 a may be a positive-typephotosensitive insulation layer formed in a liquid type as describedabove. The second connection structure 112 may be an organic blockincluding an organic material. The second insulation layer 112 a may beseen as a multilayer structure in which boundaries of the respectivelayers may be distinct, and may be seen as one layer in which boundariesof the respective layers may be unclear. A lowermost surface of thesecond insulation layer 112 a may be coplanar with a lowermost surfaceof the passivation layer 115.

The second redistribution layer 112 b may function to redistribute thesecond connection pad 122P, and, as a material for formation thereof, ametal material such as copper (Cu), aluminum (Al), silver (Ag), tin(Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloysthereof may be used. The second redistribution layer 112 b may performvarious functions, depending on a desired design. For example, a groundpattern, a power pattern, a signal pattern, and the like may beincluded. The ground pattern and the power pattern may be the samepattern. The signal pattern may include various signal patterns exceptfor a ground pattern, a power pattern, and the like, for example, a datasignal pattern. A variety of connection via pads, electrical connectionmetal pads, and the like may be also included. The lowermost surface ofthe second redistribution layer 112 b may be exposed from the lowermostsurface of the second insulation layer 112 a, and may be used as a padfor connection with the first electrical connection metal. A surfacetreatment layer (not illustrated) may be formed on the surface of thepad pattern for the first electrical connection metal 160 on thelowermost surface of the second redistribution layer 112 b, and thesurface treatment layer (not illustrated) may be plated with nickel(Ni)/gold (Au) or the like.

The second connection via 112 c may electrically connect the secondredistribution layers 112 b disposed in different layers, therebyforming an electrical path. As the material for forming the secondconnection via 112 c, a metal material, such as copper (Cu), aluminum(Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium(Ti), or alloys thereof may be used. The second connection via 112 c maybe a filled type via filled with a metal material, or may be a conformaltype via in which a metal material is formed along a wall surface of avia hole. Further, it may have a tapered shape in which a width of anupper surface thereof is wider than a width of a lower surface thereof.The second connection via 112 c may have a signal via, a ground via, apower via, etc., and the ground via and power via may be the same vias.

The third connection structure 113 may function to electrically connectthe first and second connection pads 121P and 122P of the first andsecond semiconductor chips 121 and 122 to each other. For example, thethird connection structure 113 may function to serve as an organicinterconnect bridge. The third connection structure 113 may also bedisposed in a one-to-many relationship with the second semiconductorchip 122 for convenience of alignment. For example, one third connectionstructure 113 may be disposed corresponding to the two secondsemiconductor chips 122. The third connection structure 113 may includea third insulation layer 113 a, a plurality of third redistributionlayers 113 b disposed on or in the third insulation layer 113 a, and aplurality of third connection vias 113 c disposed in the thirdinsulation layer 113 a and electrically connecting the plurality ofthird redistribution layers 113 b to each other. The third insulationlayer 113 a may have a multilayer structure. The number of layers of thethird insulation layer 113 a and of the third redistribution layer 113b, and the number of vias of the third connection via 113 c, are notparticularly limited, and may vary depending on the design.

As the material of the third insulation layer 113 a, an insulatingmaterial may be used. As the insulating material, a photosensitiveinsulating material such as PID may be used. For example, the thirdinsulation layer 113 a may be a photosensitive insulation layer. Whenthe third insulation layer 113 a has photosensitive property, the thirdinsulation layer 113 a may be relatively thinner, and the thirdinsulation layer 113 a more easily achieve the fine pitch of the thirdredistribution layer 113 b and the third connection via 113 c. The thirdinsulation layer 113 a may be a positive-type photosensitive insulationlayer formed in a liquid type as described above. The third connectionstructure 113 may also be an organic block including the organicmaterial. The third insulation layer 113 a may be seen as a multilayerstructure in which boundaries of the respective layers may be distinct,and may be seen as one layer in which boundaries of the respectivelayers may be unclear. A lowermost surface of the third insulation layer113 a may be coplanar with a lowermost surface of the passivation layer115.

The third redistribution layer 113 b may function to electricallyconnect the first and second connection pads 121P and 122P to eachother, and, as a material for formation thereof, a metal material suchas copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel(Ni), lead (Pb), titanium (Ti), or alloys thereof may be used. The thirdredistribution layer 113 b may perform various functions, depending on adesired design. For example, a ground pattern, a power pattern, a signalpattern, and the like may be included. The ground pattern and the powerpattern may be the same pattern. The signal pattern may include varioussignal patterns except for a ground pattern, a power pattern, and thelike, for example, a data signal pattern. A variety of connection viapads, electrical connection metal pads, and the like may be alsoincluded. The lowermost surface of the third redistribution layer 113 bmay be exposed from the lowermost surface of the third insulation layer113 a to use as a pad for connection with the first electricalconnection metal 160. A surface treatment layer (not illustrated) may beformed on the surface of the pad pattern for the first electricalconnection metal 160 on the lowermost surface of the thirdredistribution layer 113 b, and the surface treatment layer (notillustrated) may be plated with nickel (Ni)/gold (Au) or the like.

The third connection via 113 c may electrically connect the thirdredistribution layers 113 b disposed in different layers, therebyforming an electrical path. As the material for forming the thirdconnection via 113 c, a metal material, such as copper (Cu), aluminum(Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium(Ti), or alloys thereof may be used. The third connection via 113 c maybe a filled type via filled with a metal material, or may be a conformaltype via in which a metal material is formed along a wall surface of avia hole. Further, it may have a tapered shape in which a width of anupper surface thereof is wider than a width of a lower surface thereof.The third connection via 113 c may have a signal via, a ground via, apower via, etc., and the ground via and power via may be the same vias.

The passivation layer 115 may protect the plurality of connectionstructures 111, 112, and 113 by embedding the plurality of connectionstructures 111, 112, and 113, and may play a role of fixing theplurality of connection structures 111, 112, and 113. The passivationlayer 115 may include an insulating material. The insulating materialmay include a photosensitive insulating material. In this case, theunder bump metal 114 may be more easily formed in a fine pitch. Thepassivation layer 115 may be a negative-type photosensitive insulationlayer formed in a dry film. In this case, as described above, theplurality of connection structures 111, 112, and 113 may be easilycovered with a relatively large area, and voids or the like between theplurality of connection structures 111, 112, and 113 may be minimized.

The under bump metal 114 may include a metal pad 114 a disposed on thepassivation layer 115, and a metal via 114 b passing through thepassivation layer 115 and electrically connected to the plurality ofredistribution layers 111 b, 112 b, and 113 b. The under bump metal 114may compensate for misalignment of the plurality of redistributionlayers 111 b, 112 b, and 113 b, and the plurality of first and secondconnection pads 121P and 122P, which may occur during embedding of theplurality of connection structures 111, 112, and 113, and mayelectrically connect them. Accordingly, although the plurality ofconnection structures 111, 112, and 113 are separately manufactured, andthen embedded in the passivation layer 115 to form the interposer 110 asdescribed above, the misalignment may be effectively solved.

The metal pad 114 a may provide an area in contact with the connectionmember 140. As a material for forming the metal pad 114 a, a metalmaterial such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold(Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof may beused. The metal pad 114 a may include, for example, a ground pad, apower pad, a signal pad, and the like. The ground pad and the power padmay be the same pad. A surface treatment layer (not illustrated) may beformed on the surface of each of the metal pads 114 a, and a surfacetreatment layer (not illustrated) may be plated with nickel (Ni)/gold(Au) or the like.

The metal via 114 b may provide an electrical path between the metal pad114 a and the plurality of redistribution layers 111 b, 112 b, and 113 bby passing through an area of the passivation layer 115 covering theplurality of connection structures 111, 112, and 113. As the materialfor forming the metal via 114 b, a metal material, such as copper (Cu),aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb),titanium (Ti), or alloys thereof may be used. The metal via 114 b may bea filled type via filled with a metal material, or may be a conformaltype via in which a metal material formed along a wall surface of a viahole. Further, it may have a tapered shape in which a width of an uppersurface thereof is wider than a width of a lower surface thereof, in asimilar manner to the first to third connection vias 111 c, 112 c, and113 c. The metal via 114 b may have a signal via, a ground via, a powervia, etc., and the ground via and power via may be the same vias.

The first semiconductor chip 121 may be in the form of an integratedcircuit (IC) in which hundreds to millions of devices are integratedinto one chip. In this case, silicon (Si), germanium (Ge), galliumarsenide (GaAs), or the like may be used as a base material of a body.The body may have various circuits formed therein. The first connectionpad 121P of the first semiconductor chip 121 may be for electricallyconnecting the first semiconductor chip 121 to other components, and maybe formed of copper (Cu), aluminum (Al), or the like without anyparticular limitation. A passivation film (not illustrated) may beformed on the body to expose the first connection pad 121P. Thepassivation film (not illustrated) may be an oxide film, a nitride film,or a double layer of the oxide film and the nitride film. An insulationfilm (not illustrated) or the like may be further disposed in otherappropriate position(s) wherein insulation is to be provided. A firstmetal bump 121B in contact with the connection member 140 may bedisposed on the first connection pad 121P. The first metal bump 121B mayinclude a metal material such as copper (Cu), and the like.

The second semiconductor chip 122 may also be in the form of anintegrated circuit (IC) in which hundreds to millions of devices areintegrated into one chip. The second semiconductor chip 122 may beformed by stacking a plurality of such integrated circuits (IC). Thestacked integrated circuits (IC) may be electrically connected to eachother through a through-silicon via (TSV) or the like. The secondsemiconductor chip 122 may also have a second connection pad 122P forelectrically connecting the second semiconductor chip 122 to anothercomponent. In this case, it can be understood that the second connectionpad 122P is disposed on a lowermost surface of the second semiconductorchip 122, facing the interposer 110. A second metal bump 122B in contactwith the connection member 140 may be disposed on the second connectionpad 122P, and the second metal bump 122B may include a metal materialsuch as copper (Cu), and the like.

The first semiconductor chip 121 may be an application specificintegrated circuit (ASIC) such as a graphics processing unit (GPU). Thesecond semiconductor chip 122 may be a stacked memory such as a highbandwidth memory (HBM). For example, the first and second semiconductorchips 121 and 122 may be expensive chips each having tens to millions ofI/Os, but is not limited thereto. The second semiconductor chips 122 maybe arranged in a larger number than the first semiconductor chips 121,and may be disposed around the first semiconductor chips 121,respectively. For example, two second semiconductor chips 122 may bedisposed on opposing sides of the first semiconductor chip 121.

The encapsulant 130 may protect the first and second semiconductor chips121 and 122. A form of the encapsulant 130 is not particularly limited,and may be any shape that covers at least a portion of each of the firstand second semiconductor chips 121 and 122. The encapsulant 130 may alsobe in the form or shape to wrap or extend around the underfill resin 150as well. For example, the encapsulant 130 may cover at least a portionof the side surfaces of each of the first and second semiconductor chips121 and 122 and at least a portion of the side surface of the underfillresin 150. The encapsulant 130 may include an insulating material.Examples of the insulating material may include a thermosetting resinsuch as an epoxy resin, a thermoplastic resin such as polyimide, or aresin including a thermosetting resin or a thermoplastic resin as wellas a reinforcing material such as an inorganic filler, specifically ABF,FR-4, BT resin, etc. In addition, a photo imageable encapsulant (PIE)may be used as needed. Alternatively, a material in which inorganicfillers are impregnated in the insulating resin such as a thermosettingresin or a thermoplastic resin, for example, a prepreg, or the like maybe used. Optionally, the back surface of each of the first and secondsemiconductor chips 121 and 122 and the back surface of the encapsulant130 may be made coplanar with each other through a grinding process. Asabove, when the first and second semiconductor chips 121 and 122 areexposed, the heat dissipation effect may be improved.

The connection member 140 may connect the respective under bump metal114 to the first and second connection pads 121P and 122P, morespecifically to the first and second metal bumps 121B and 122B, therebyforming an electrical path. The connection member 140 may include a lowmelting metal selected from the group consisting of tin (Sn), and alloyscontaining tin (Sn), and, may be, for example a solder bump. Forexample, the first and second semiconductor chips 121 and 122 may besurface-mounted on the interposer 110 using the plurality of under bumpmetals 114 and the plurality of connection members 140.

The underfill resin 150 may fix the first and second semiconductor chips121 and 122 surface-mounted on the interposer 110, and may also protectthem by covering at least a portion of each of the plurality of underbump metals 114, the plurality of connection members 140, and theplurality of first and second metal bumps 121B and 122B between thefirst and second semiconductor chips 121 and 122, and the interposer110. The material of the underfill resin 150 is not particularlylimited, and an insulating material having an adhesive property such asan epoxy resin may be used. The underfill resin 150 may be introduced ina plurality of shapes corresponding to the first and secondsemiconductor chips 121 and 122, and the first and second semiconductorchips 121 and 122 may also be introduced in a single form to be fixed atone time.

The first electrical connection metal 160 may physically and/orelectrically connect the semiconductor package 100 externally. Forexample, the semiconductor package 100 may be mounted on a BGA substrateor the like through the first electrical connection metal 160. The firstelectrical connection metal 160 may be formed of the above-described lowmelting point metal, for example, a solder, but this may be merely anexample, and the material is not particularly limited thereto. The firstelectrical connection metal 160 may be a land, a solder ball, a pin, orthe like. The first electrical connection metal 160 may be formed as amultilayer or a single layer. In a case of being formed of multiplelayers, it may include a copper pillar and a solder. In a case of beingformed of a single layer, tin-silver solder or copper may be included,but this may be merely an example and is not limited thereto. Thenumber, interval, arrangement type, etc., of the first electricalconnection metal 160 are not particularly limited, and may besufficiently modified, depending on a design specification by a skilledartisan. For example, the number of first electrical connection metal160 may be in the range of tens to thousands, depending on the number offirst and second connection pads 121P and 122P, and may be more or lessthan the above range.

A printed circuit board 200 may be disposed on a lower side of theinterposer 110 of the semiconductor package 100, and the printed circuitboard 200 may be connected to the first electrical connection metal 160.For example, the semiconductor package 100 may be surface-mounted on theprinted circuit board 200 through the first electrical connection metal160. The printed circuit board 200 may be mounted on the main board ofthe electronic device via the second electrical connection metal 210.The printed circuit board 200 may be a BGA substrate, but is not limitedthereto.

The semiconductor package 100 with the printed circuit board 200 and/orthe second electrical connection metal 210 disposed may be manufactured.For example, the semiconductor package 100 may include the printedcircuit board 200 and/or the second electrical connection metal 210.

FIG. 9 is a schematic modified plan view illustrating another example ofa semiconductor package, taken along line I-I′ of FIG. 6.

Referring to the drawings, the number of second and third connectionstructures 112 and 113 may be further divided, depending on the numberof second semiconductor chips 122, respectively. For example, the secondand third connection structures 112 and 113 may be formed in the samenumber as the number of the second semiconductor chips 122, and thenembedded in an interposer 110, respectively. As described above, asemiconductor package 100 according to the example may be manufacturedby separating the second and third connection structures 112 and 113 toconform their process abilities; selecting only good componentstherefrom through electrical inspection to separate them from each otherby a singulation process in a unit; and arranging them corresponding tothe positions of the second semiconductor chips 122. Therefore, processdifficulty may be relatively reduced, and efficiency and yield in aprocess may be relatively increased. Optionally, only the secondconnection structure 112 may be further divided, and the thirdconnection structure 113 may be configured as illustrated in FIG. 8.Alternatively, only the third connection structure 113 may be furtherdivided, and the second connection structure 112 may be configured asillustrated in FIG. 8.

FIG. 10 is a schematic modified plan view illustrating another exampleof a semiconductor package taken along line I-I′ of FIG. 6.

Referring to the drawings, a first semiconductor chips 121 may bearranged in a plurality, and a second semiconductor chips 122 may bearranged around first semiconductor chips 121 in a relatively largenumber. In this case, an interposer 110 may also be formed in arelatively large area. As described above, a semiconductor package 100according to an example may lower process difficulty, increaseefficiency and yield in process, and solve warpage or misalignmentproblem. Nevertheless, the interposer 110 having a relatively large areamay be included. Therefore, the high quality of the set may easily beprovided by the interposer 110.

FIG. 11 is a schematic modified plan view illustrating another exampleof a semiconductor package taken along line I-I′ of FIG. 6.

Referring to the drawings, when a plurality of first semiconductor chips121 are arranged, and second semiconductor chips 122 in a relativelylarge number are also arranged around the first semiconductor chips 121,first to third connection structures 111, 112, and 113 may be furtherdivided into a plurality of groups, respectively. For example, the firstconnection structure 111 may be divided into the same number as that ofthe first semiconductor chips 121, and the second and third connectionstructures 112 and 113 may be divided into a number of half the numberof second semiconductor chip 122. By dividing the first to thirdconnection structures 111, 112, and 113 in such a manner, the interposer110 having a relatively large area may be manufactured with a relativelylow processing difficulty, and as a result, efficiency and yield inprocess may be further increased. Optionally, only the first and secondconnection structures 111 and 112 may be further divided, and the thirdconnection structure 113 may be configured as illustrated in FIG. 10.Alternatively, only the third connection structure 113 may be furtherdivided, and the first and second connection structures 111 and 112 maybe configured as illustrated in FIG. 10. Alternatively, only the firstconnection structure 111 may be further divided, and the second andthird connection structures 112 and 113 may be configured as illustratedin FIG. 10.

FIG. 12 is a schematic modified plan view illustrating another exampleof a semiconductor package taken along line I-I′ of FIG. 6.

Referring to the drawings, when a plurality of first semiconductor chips121 are arranged, and second semiconductor chips 122 in a relativelylarge number are also arranged around the first semiconductor chips 121,first to third connection structures 111, 112, and 113 may be furtherdivided into a plurality of groups, respectively. For example, the firstconnection structure 111 may be divided into a number same as the numberof first semiconductor chips 121, the second connection structure 112and the third connection structure 113 may be divided into a number sameas the number of the second semiconductor chips 122, respectively. Bydividing the first to third connection structures 111, 112, and 113 insuch a manner, the interposer 110 having a relatively large area may bemanufactured with a relatively low processing difficulty, and as aresult, efficiency and yield in process may be further increased.Optionally, only the first and second connection structures 111 and 112may be further divided, and the third connection structure 113 may beconfigured as illustrated in FIG. 10 or 11. Alternatively, only thethird connection structure 113 may be further divided, and the first andsecond connection structures 111 and 112 may be configured asillustrated in FIG. 10 or 11. Alternatively, only the first connectionstructure 111 may be further divided, and the second and thirdconnection structures 112 and 113 may be configured as illustrated inFIG. 10 or 11.

FIGS. 13 to 15 are schematic process diagrams illustrating sequentialsteps of an example process of manufacturing the semiconductor packageof FIG. 6.

Referring to FIG. 13, first, a carrier 300 may be prepared. The carrier300 may be a glass carrier. The present disclosure is not limitedthereto, and may be, for example, a copper clad laminate (CCL). Afterthe carrier 300 is prepared, an insulation layer 310 may be formed onthe carrier 300. The insulation layer 310 may include an inorganicfiller and an insulating resin. For example, the insulation layer 310may include a thermosetting resin such as an epoxy resin, athermoplastic resin such as polyimide, or a resin in which athermosetting resin or a thermoplastic resin are mixed with an inorganicfiller, for example, ABF (Ajinomoto Build-up Film), or the like. Next, aplurality of connection structures 111, 112, and 113 may be disposed onthe insulation layer 310, respectively. Specifically, a plurality ofconnection structures 111, 112, and 113 having a difference in processdifficulty may be separately manufactured by a plating process, aphotolithography process, or the like, to conform their processabilities. Each of the connection structures 111, 112, and 113 may havea pad pattern that may be connected to the electrical connection metalon a lowermost surface thereof, and may have a pad pattern that may beconnected to the under bump metal on an uppermost surface thereof. Onlygood components may be selected from the manufactured plurality ofconnection structures 111, 112, and 113 through electrical inspection toseparate them from each other by a singulation process in a unit, to beattached to the insulation layer 310 to correspond to first and secondsemiconductor chips 121 and 122 on the insulation layer 310. An adhesive(not illustrated) may be used for the attachment. The adhesive (notillustrated) may be easily removed after a subsequent process, and athermally stable material may be preferably used. For example, a liquidor film type adhesive maintaining relatively high temperature stabilityat 300 degrees or more may be applied.

Referring to FIG. 14, a passivation layer 115 may be formed on theinsulation layer 310 to cover and fill spaces between the plurality ofconnection structures 111, 112, and 113. The passivation layer 115 maybe formed by stacking a dry film and curing it. Next, at least a portionof an uppermost pad pattern of each of a plurality of redistributionlayers 111 b, 112 b, and 113 b may be exposed through the passivationlayer 115 by a photolithography method or the like to form openings.Thereafter, a metal pad 114 a and a metal via 114 b may be formed on therespective openings by a plating method, such as, an additive process(AP), a semi-AP (SAP) process, a modified SAP (MSAP) process, a tentingprocess, and the like. Optionally, a surface treatment layer (notillustrated) may be formed on a surface of the metal pad 114 a by usingnickel (Ni)/gold (Au) or the like. Next, the first and secondsemiconductor chips 121 and 122 may be surface-mounted on an interposer110 in such a manner that first and second metal bumps 121B and 122B onthe first and second connection pads 121P and 122P of the first andsecond semiconductor chips 121 and 122 are connected to respective underbump metals of the plurality of under bump metals 114 by using aplurality of connection members 140. Thereafter, by filling a spacebetween the first and second semiconductor chips 121 and 122 and theinterposer 110 with an underfill resin 150, the first and secondsemiconductor chips 121 and 122 may be fixed and the plurality of firstand second metal bumps 121B and 122B, the plurality of under bump metals114, and the plurality of connection members 140 may be covered.

Referring to FIG. 15, an encapsulant 130 may be formed on the interposer110 to cover and fill a space between the first and second semiconductorchips 121 and 122, the underfill resin 150, and the like. Theencapsulant 130 may be formed by stacking a film-type ABF or the like,and curing it. Thereafter, back surfaces of the first and secondsemiconductor chips 121 and 122 may optionally be exposed from a backsurface of the encapsulant 130 through a grinding process. Next, thecarrier 300 and the insulation layer 310 may be separated and removed.Next, a plurality of first electrical connection metals 160 may beformed on lowermost pad patterns of the connection structures 111, 112,and 113 using a low melting point metal, such as solder, or the like. Asurface treatment layer (not illustrated) may be formed on surfaces ofthe lowermost pad patterns of each of the connection structures 111,112, and 113 by using nickel (Ni)/gold (Au) or the like. Thereafter,through a reflow process, a semiconductor package 100 according to theabove-described example may be manufactured through a series ofprocesses. Thereafter, the semiconductor package 100 may besurface-mounted on a printed circuit board 200 on which a secondelectrical connection metal 210 is formed via the first electricalconnection metal 160, as needed.

In the present disclosure, the words lower, lower portion, lowersurface, and the like are used to refer to the downward direction (inthe vertical direction of the drawings, also referred to as thethickness direction) with respect to the cross section of the drawingfor convenience, while the words upper, upper portion, upper surface,and the like are used to refer to a direction opposite thereto. Itshould be understood that, these directions are defined for convenienceof explanation, the scope of the claims is not particularly limited bythe description of such directions, and the concepts of theupward/downward directions may be changed at any time.

The term of “connect” or “connection” in the present disclosure may benot only a direct connection, but also a concept including an indirectconnection through an adhesive layer or the like. In addition, the term“electrically connected” or “electrical connection” is a conceptincluding both a physical connection and a physical non-connection.Also, the expressions of “first,” second,” etc. are used to distinguishone component from another, and do not limit the order and/or importanceof the components. In some cases, without departing from the spirit ofthe present disclosure, the first component may be referred to as asecond component, and similarly, the second component may be referred toas a first component.

The expression “an example embodiment” used in the present disclosure donot all refer to the same embodiment, but may be provided foremphasizing and explaining different unique features. However, theabove-mentioned example embodiments do not exclude that they areimplemented in combination with the features of other exampleembodiments. For example, although the description in the specificexample embodiment may be not described in another example embodiment,it may be understood as an explanation related to another exampleembodiment, unless otherwise described or contradicted by the otherexample embodiment.

The terms used in the present disclosure are used only to illustrate anexample embodiment, and are not intended to limit the presentdisclosure. At this time, the singular expressions include pluralexpressions unless the context clearly dictates otherwise.

According to an aspect of the present disclosure, a semiconductorpackage is provided that is capable of lowering manufacturing processdifficulty, increasing efficiency and yield in process, and solvingwarpage or misalignment problems, while still being capable of includingan interposer having a relatively large area.

While examples have been illustrated and described above, it will beapparent to those skilled in the art that modifications and variationscould be made without departing from the scope of the present disclosureas defined by the appended claims.

What is claimed is:
 1. A semiconductor package comprising: an interposerincluding a plurality of connection structures disposed to be spacedapart from each other in a first direction, and each including aninsulation layer and a plurality of redistribution layers extending inthe first direction and disposed in or on the insulation layer andelectrically connected to each other, the plurality of redistributionlayers of different connection structures of the plurality of connectionstructures being parallel to each other, and a passivation layercovering at least a portion of each of the plurality of connectionstructures and filling at least a portion of a space between theplurality of connection structures; a first semiconductor chip disposedon the interposer and having a plurality of first connection pads; and asecond semiconductor chip disposed on the interposer and adjacent in thefirst direction to the first semiconductor chip, the secondsemiconductor chip having a plurality of second connection pads, whereinthe plurality of connection structures are independently disposed toeach at least partially overlap with at least one of the first andsecond semiconductor chips, in a stacking direction of the first andsecond semiconductor chips on the interposer, the plurality ofredistribution layers of each of the plurality of connection structuresare electrically connected to at least one of the pluralities of firstand second connection pads, and the insulation layer and the passivationlayer include different materials, the plurality of connectionstructures comprises a first connection structure disposed such that atleast a portion thereof overlaps the first semiconductor chip, in thestacking direction, a second connection structure disposed such that atleast a portion thereof overlaps the second semiconductor chip, in thestacking direction, and a third connection structure disposed such thatat least a portion thereof respectively overlaps the first and secondsemiconductor chips, in the stacking direction, the plurality ofredistribution layers of the first connection structure redistribute atleast one of the plurality of first connection pads, the plurality ofredistribution layers of the second connection structure redistribute atleast one of the plurality of second connection pads, and the pluralityof redistribution layers of the third connection structure electricallyconnect at least one of the plurality of first connection pads and atleast one of the plurality of second connection pads to each other. 2.The semiconductor package according to claim 1, wherein the insulationlayer and the passivation layer each include a photosensitive insulationlayer.
 3. The semiconductor package according to claim 2, wherein theinsulation layer is a positive-type photosensitive insulation layer, andthe passivation layer is a negative-type photosensitive insulationlayer.
 4. The semiconductor package according to claim 1, wherein anuppermost surface of the insulation layer of each of the plurality ofconnection structures facing the first and second semiconductor chips,is coplanar with a surface of the passivation layer contacting theuppermost surface.
 5. The semiconductor package according to claim 1,wherein the interposer further comprises a plurality of under bumpmetals each including a metal pad disposed on the passivation layer anda metal via passing through the passivation layer and electricallyconnecting the metal pad and a redistribution layer of the plurality ofredistribution layers of the plurality of connection structures, whereinthe plurality of under bump metals are electrically connected to thepluralities of first and second connection pads via a plurality ofconnection members, respectively.
 6. The semiconductor package accordingto claim 5, wherein the plurality of connection members comprise a lowmelting point metal selected from the group consisting of tin (Sn), andalloys containing tin (Sn).
 7. The semiconductor package according toclaim 5, wherein a plurality of first and second metal bumps arerespectively disposed on the pluralities of first and second connectionpads and respectively connected to the plurality of connection members.8. The semiconductor package according to claim 7, further comprising anunderfill resin disposed on the interposer, and covering at least aportion of each of the plurality of under bump metals, the plurality ofconnection members, and the pluralities of first and second metal bumps,between the first and second semiconductor chips and the interposer. 9.The semiconductor package according to claim 8, further comprising anencapsulant disposed on the interposer and covering at least a portionof each of the first and second semiconductor chips and the underfillresin.
 10. The semiconductor package according to claim 9, wherein anupper surface of each of the first and second semiconductor chips,opposite to a lower surface of each of the first and secondsemiconductor chips facing the interposer, is coplanar with an uppersurface of the encapsulant opposite to a lower surface of theencapsulant facing the interposer.
 11. The semiconductor packageaccording to claim 1, wherein the first to third connection structureshave substantially the same thickness as each other, and the pluralityof redistribution layers of each of the first to third connectionstructures have the same number of layers.
 12. The semiconductor packageaccording to claim 1, wherein the first semiconductor chip comprises agraphics processing unit (GPU), the second semiconductor chip comprisesa plurality of high bandwidth memory (HBM) chips, and the HBM chips aredisposed in a larger number than that of the first semiconductor chip inthe semiconductor package.
 13. The semiconductor package according toclaim 1, further comprising: a plurality of first electrical connectionmetals disposed on a second surface of the interposer opposite to afirst surface of the interposer on which the first and secondsemiconductor chips are arranged, and electrically connected to theplurality of redistribution layers of each of the plurality ofconnection structures; a printed circuit board disposed on the secondsurface of the interposer, and connected to the plurality of firstelectrical connection metals; and a second electrical connection metaldisposed on a surface of the printed circuit board opposite to a surfaceof the printed circuit board on which the interposer is disposed, andconnected to the printed circuit board.
 14. A semiconductor packagecomprising: an interposer including a plurality of connection structuresdisposed to be spaced apart from each other in a first direction, andeach including a plurality of redistribution layers extending in thefirst direction and electrically connected to each other, theredistribution layers of different connection structures of theplurality of connection structures being parallel to each other, apassivation layer covering at least a portion of each of the pluralityof connection structures and filling at least a portion between theplurality of connection structures, and a plurality of under bump metalseach including a metal pad disposed on the passivation layer and a metalvia passing through the passivation layer and electrically connectingthe metal pad and a redistribution layer of the plurality ofredistribution layers; a first semiconductor chip disposed on theinterposer and having a plurality of first connection pads; and a secondsemiconductor chip disposed on the interposer and adjacent in the firstdirection to the first semiconductor chip, the second semiconductor chiphaving a plurality of second connection pads, wherein the plurality ofconnection structures are disposed to each at least partially overlapwith at least one of the first and second semiconductor chips, in astacking direction of the first semiconductor chip on the interposer,the plurality of redistribution layers of each of the plurality ofconnection structures are electrically connected to at least one of theplurality of first and second connection pads via the plurality of underbump metals, the plurality of connection structures comprises a firstconnection structure disposed such that at least a portion thereofoverlaps the first semiconductor chip, in the stacking direction, asecond connection structure disposed such that at least a portionthereof overlaps the second semiconductor chip, in the stackingdirection, and a third connection structure disposed such that at leasta portion thereof respectively overlaps the first and secondsemiconductor chips, in the stacking direction, the plurality ofredistribution layers of the first connection structure redistribute atleast one of the plurality of first connection pads, the plurality ofredistribution layers of the second connection structure redistribute atleast one of the plurality of second connection pads, and the pluralityof redistribution layers of the third connection structure electricallyconnect at least one of the plurality of first connection pads and atleast one of the plurality of second connection pads to each other. 15.The semiconductor package according to claim 14, wherein a plurality offirst and second metal bumps are arranged on the plurality of first andsecond connection pads, respectively, and the plurality of under bumpmetals are electrically connected to the plurality of first and secondmetal bumps via a plurality of connection members.
 16. An interposer forconnecting and redistributing a plurality of connection pads of a firstsemiconductor chip and a second semiconductor chip mounted on an uppersurface thereof to connection structures exposed through a lower surfacethereof, the interposer comprising: a plurality of connection structuresdisposed to be spaced apart from each other in a first direction, eachincluding a respective insulation layer and a plurality ofredistribution layers extending in the first direction and stacked in asecond direction perpendicular to the first direction and disposed in oron the respective insulation layer and electrically connected to eachother, the plurality redistribution layers of different connectionstructures of the plurality of connection structures being parallel toeach other in the interposer; and a passivation layer having theplurality of connection structures embedded therein, the passivationlayer extending over upper surfaces of each of the plurality ofconnection structures, and the passivation layer having lower surfacesof each of the plurality of connection structures exposed through alower surface thereof, wherein the plurality of connection structurescomprises a first connection structure disposed such that at least aportion thereof overlaps the first semiconductor chip in a stackingdirection, a second connection structure disposed such that at least aportion thereof overlaps the second semiconductor chip in the stackingdirection, and a third connection structure disposed such that at leasta portion thereof respectively overlaps the first and secondsemiconductor chips, in the stacking direction, wherein the plurality ofredistribution layers of the first connection structure redistribute atleast one of a plurality of first connection pads of the firstsemiconductor chip, the plurality of redistribution layers of the secondconnection structure redistribute at least one of a plurality of secondconnection pads of the second semiconductor chip, and the plurality ofredistribution layers of the third connection structure electricallyconnect at least one of the plurality of first connection pads and atleast one of the plurality of second connection pads to each other. 17.The interposer of claim 16, further comprising: a plurality of underbump metals each including a metal pad disposed on the passivation layerand a metal via extending through the passivation layer to contact atopmost redistribution layer of the plurality of redistribution layersof the connection structures.
 18. The interposer of claim 16, wherein alowermost redistribution layer of the plurality of redistribution layersof the connection structures is exposed through the lower surface of theinterposer.
 19. The interposer of claim 18, wherein a lower surface ofthe lowermost redistribution layers of the connection structures iscoplanar with a lower surface of the passivation layer, and theinterposer further comprises a plurality of electrical connection metalbumps including a solder, each disposed on a respective one of thelowermost redistribution layers of the plurality of connectionstructures.